주요 콘텐츠로 건너뛰기

알림: 귀하는 선행 작업 안내서를 편집하고 계십니다. 변경된 사항들은 이 선행 작업 단계를 포함하는 안내서 14개에 영향을 미칩니다.

영어
프랑스어
3 단계
Use the tip of a spudger to pry the small grounding clip up off the logic board. Carefully grasp the grounding clip and remove it from the iPhone.
  • Use the tip of a spudger to pry the small grounding clip up off the logic board.

  • Carefully grasp the grounding clip and remove it from the iPhone.

  • Before reassembly, be sure to clean all metal-to-metal contact points on the grounding clip (not the mating halves of connectors) with a de-greaser such as windex or isopropyl alcohol. The oils on your fingers have the potential to cause grounding issues.

Utilisez la pointe d'une spatule (spudger) pour enlever le petit clip de mise à la terre de la carte mère.

Saisissez soigneusement le clip et retirez-le de l'iPhone.

Avant le remontage, assurez-vous de bien nettoyer tous les points de contact métal sur métal du clip de mise à la terre (pas les deux parties assorties des connecteurs) avec un nettoyant dégraissant tel que du windex ou de l'alcool isopropylique. Le sébum sur vos doigts peut causer des problèmes de mise à la terre.

귀하의 기여는 오픈 소스 Creative Commons 인가 하에 허가되었습니다.