주요 콘텐츠로 건너뛰기

알림: 귀하는 선행 작업 안내서를 편집하고 계십니다. 변경된 사항들은 이 선행 작업 단계를 포함하는 안내서 14개에 영향을 미칩니다.

5 단계
Slide the opening pick down the side of the phone, separating the adhesive. Go slowly so that the tool doesn't slip out of the seam. If cutting becomes difficult, reheat and reapply the iOpener.
  • Slide the opening pick down the side of the phone, separating the adhesive.

  • Go slowly so that the tool doesn't slip out of the seam. If cutting becomes difficult, reheat and reapply the iOpener.

将撬片或 Halberd 撬棒的刀片沿着手机侧面滑下,分离粘合剂。

缓慢移动,以免工具从接缝中滑出。 如果切割变得困难,请重新加热并重新使用iOpener(软化粘合剂)。

-[* black] Slide an opening pick or the blade of a Halberd spudger down the side of the phone, separating the adhesive.
+[* black] Slide the opening pick down the side of the phone, separating the adhesive.
[* icon_note] Go slowly so that the tool doesn't slip out of the seam. If cutting becomes difficult, reheat and reapply the iOpener.

귀하의 기여는 오픈 소스 Creative Commons 인가 하에 허가되었습니다.