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14 단계 번역 중

14 단계
The next piece out is the processor and GPU heat sink and exhaust air vent assembly. By pushing the air through a restriction before it gets to the outermost vents, you introduce an additional pressure drop (due to fluid shear stress at the walls) that accelerates the air and pushes it out of the computer faster. With that last obstacle out of the way, the logic board comes out fairly effortlessly.
  • The next piece out is the processor and GPU heat sink and exhaust air vent assembly.

  • By pushing the air through a restriction before it gets to the outermost vents, you introduce an additional pressure drop (due to fluid shear stress at the walls) that accelerates the air and pushes it out of the computer faster.

  • With that last obstacle out of the way, the logic board comes out fairly effortlessly.

La próxima parte en salir es el procesador y disipador de calor GPU y el ensamblaje de salida de aire.

Al empujar el aire a través de una restricción antes de que llegue a los conductos de ventilación más externos, introduces una caída de presión adicional (debido al esfuerzo cortante en las paredes) que acelera el aire y lo empuja hacia afuera de la computadora más rápido.

Con este último obstáculo fuera de camino, la placa lógica sale sin bastante esfuerzo.

귀하의 기여는 오픈 소스 Creative Commons 인가 하에 허가되었습니다.