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이전 단계 다음 단계

14 단계 번역 중

14 단계
The next piece out is the processor and GPU heat sink and exhaust air vent assembly. By pushing the air through a restriction before it gets to the outermost vents, you introduce an additional pressure drop (due to fluid shear stress at the walls) that accelerates the air and pushes it out of the computer faster. With that last obstacle out of the way, the logic board comes out fairly effortlessly.

  • The next piece out is the processor and GPU heat sink and exhaust air vent assembly.

  • By pushing the air through a restriction before it gets to the outermost vents, you introduce an additional pressure drop (due to fluid shear stress at the walls) that accelerates the air and pushes it out of the computer faster.

  • With that last obstacle out of the way, the logic board comes out fairly effortlessly.

Puis, c'est au tour de l'ensemble processeur et dissipateur thermique GPU et ouverture d'évacuation d'air.

Ici, l'air est poussé à travers une ouverture réduite avant qu'il n'arrive à l'ouverture de ventilation externe, la contrainte de cisaillement du fluide contre les parois crée une baisse de pression supplémentaire, accélère l'air et le pousse plus rapidement en dehors de l'ordinateur.

Ce dernier obstacle étant surmonté, la carte mère s'enlève pratiquement sans efforts.

귀하의 기여는 오픈 소스 Creative Commons 인가 하에 허가되었습니다.