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How did Apple put even more tech in 70% of the footprint? By folding the board in half, of course. The two halves are soldered together, so we got some help from our hosts Circuitwise and their BGA hot air rework station to separate the layers. With the pieces separated, we tallied the area of all of the separate layers, and added it up to 135% of the iPhone 8 Plus logic board's area. Way to go putting more into less, Apple.
  • How did Apple put even more tech in 70% of the footprint? By folding the board in half, of course.

  • The two halves are soldered together, so we got some help from our hosts Circuitwise and their BGA hot air rework station to separate the layers.

  • With the pieces separated, we tallied the area of all of the separate layers, and added it up to 135% of the iPhone 8 Plus logic board's area. Way to go putting more into less, Apple.

  • The iPhone X logic board is the first double-stacked board we've seen in an iPhone since the very first iPhone (third photo).

  • The downside of this clever design is that many board-level repairs will be a lot more difficult.

Wie hat es Apple bloß geschafft noch mehr Technik in nur 70% der Fläche unterzubringen? Natürlich indem sie es einmal in der Mitte falten.

Die beiden Hälften sind in der Mitte zusammengelötet, also halfen uns unsere Freunde von Circuitwise mit ihrer BGA Trennstation, die Schichten zu separieren.

Nachdem wir die beiden Hälften getrennt haben ergaben sie eine Gesamtoberfläche von 135% gegenüber dem iPhone 8 Plus: Starke Leistung, mehr in weniger zu verpacken!

Das iPhone 10 hat das erste doppelstöckige Logic Board – seit dem allerersten iPhone (drittes Bild).

Der Nachteil dieses cleveren Designs ist, dass viele Reparaturen auf Boardlevel viel schwieriger werden.

귀하의 기여는 오픈 소스 Creative Commons 인가 하에 허가되었습니다.