주요 콘텐츠로 건너뛰기

기기를 수리하세요

수리할 권리

상점

도움말
14단계 편집 중 —

단계 유형:

끌어서 재배열 합니다

The Murata Wi-Fi SoC module actually comprises a Broadcom BCM4334 package in addition to an oscillator, capacitors, resistors, etc. You can see all the components in the X-ray (third image).

Murata assembles all of the components together and sends their package to Foxconn, where it eventually ends up on the iPhone's logic board. Chipworks said it best: "Murata makes a house that is full of other people's furniture."

Here are the die images for the Broadcom BCM4334, fabricated in Taiwan at TSMC on a 40 nm CMOS process. Its key features:

Wi-Fi (802.11 a/b/g/n)

Bluetooth 4.0 + HS

FM Receiver

귀하의 기여는 오픈 소스 Creative Commons 인가 하에 허가되었습니다.