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도움말
6단계 편집 중 —

단계 유형:

끌어서 재배열 합니다

We peel the motherboard out of the chassis to get a better look at this wearable's hardware:

SK Hynix H9TU32A4GDMC 512 MB mobile DDR2. The Qualcomm Snapdragon 400 SoC is hidden beneath this DRAM device.

Qualcomm PM8226 PMIC

Broadcom BCM4343 integrated communications module

Single microphone—we're not sure why there were two ports; maybe just symmetry?

Vibrator motor—soldered in place on the motherboard

귀하의 기여는 오픈 소스 Creative Commons 인가 하에 허가되었습니다.