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상점

도움말
6단계 편집 중 —

단계 유형:

끌어서 재배열 합니다

We peel the motherboard out of the chassis to get a better look at this wearable's hardware:

SK Hynix H9TU32A4GDMC-LRKGM 512 MB mobile DDR2. The Qualcomm Snapdragon 400 SoC is hidden beneath this DRAM device.

Qualcomm PM8226 power management IC

Broadcom BCM4343 integrated communications module

Texas Instruments BQ27421-G1 battery fuel gauge

Single microphone (Knowles) —we're not sure why there were two ports; maybe just symmetry?

Vibrator motor—soldered in place on the motherboard

귀하의 기여는 오픈 소스 Creative Commons 인가 하에 허가되었습니다.