주요 콘텐츠로 건너뛰기
도움말
6단계 편집 중 —

단계 유형:

끌어서 재배열 합니다

Who left their gum in here? Peeling up the motherboard reveals more thermal paste in a phone than we've seen in awhile.

Here are the front-side chips:

HiSilicon Kirin 955 (likely a HiSilicon Hi3650) octa-core processor layered underneath 3 GB of SK Hynix H9CKNNNDATMUQRN-UH LPDDR3 RAM

Samsung KLMBG2JENB-B041 32 GB eMMC NAND flash memory

Texas Instruments BQ25892 fast charging IC

HiSilicon Hi6402 audio codec

Maxim Integrated MAX98925 audio amplifier

Altek AL6610-72M1 AI camera processor (likely)

귀하의 기여는 오픈 소스 Creative Commons 인가 하에 허가되었습니다.