If I understand correctly, reflowing does not solve the problem in the long run because it actually lies in the solder bump area within the underfill, where the main die makes contact with the substrate.
These are tiny balls, almost impossible to fix but with the application of heat the problem is temporarily rectified so as the underfill is moved around etc and some contact may be re-made temporarily, but is largely design error in the chip production and in the end a full swap out is the only real solution.
The issue is *not* in the larger solder balls found where the substrate makes connection to the board, as most people expect.
But it could be in some cases with a warped or bent board.
일단 획득하면, 귀하께서는 그들의 시간당 평판 획득 도표를 볼 수 있습니다.
도표가 어떻게 보여질지에 대한 미리보기입니다:
아직 획득한 평판이 없습니다.