소개
In this guide you will open up the back of the device and locate the 3.5mm headphone jack on the mother board. Once it is found you must remove it with a soldering iron and replace it.
Because this task requires the use of a soldering iron, prior experience with soldering/desoldering will be beneficial.
필요한 것
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Wedge the plastic opening tool between the back cover of the device and the front panel.
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You will hear a snapping sound as the cover is separated from the body of the device.
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거의 끝나갑니다!
To reassemble your device, follow these instructions in reverse order.
결론
To reassemble your device, follow these instructions in reverse order.