#5단계의 변경 사항
편집 승인됨 완료자 Dominik Schnabelrauch
- 이전
- 이후
- 변경 사항 없음
단계 라인
| - | [* black] Insert wisdom here. |
|---|---|
| + | [* black] If the adhesive becomes hard to cut, it most likely cooled down. [guide|25705|Use your iOpener|new_window=true] to reheat it. |
| + | [* black] Insert a fourth opening pick under the top left corner of the back cover. |
| + | [* black] Slide the opening pick along the top edge of the phone to cut the adhesive. |
| + | [* black] Leave the opening pick in the top right corner to prevent the adhesive from resealing. |