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소개

Follow this guide to replace the 3.5mm headphone jack and game card reader board in a Nintendo Switch gaming console.

  1. Remove the four 6.3mm Tri-point Y00 screws from the rear panel.
    • Remove the four 6.3mm Tri-point Y00 screws from the rear panel.

  2. Remove the single 6.1mm JIS #000 screw from underneath the kickstand.
    • Remove the single 6.1mm JIS #000 screw from underneath the kickstand.

  3. Remove the two 2.7mm JIS #000 screws from the bottom of the device.
    • Remove the two 2.7mm JIS #000 screws from the bottom of the device.

  4. Remove the single 2.7mm JIS #000 screw from the top of the device.
    • Remove the single 2.7mm JIS #000 screw from the top of the device.

  5. Remove the single 3.8mm JIS #0 screw from the right Joy-Con rail. Remove the single 3.8mm JIS #0 screw from the left Joy-Con rail.
    • Remove the single 3.8mm JIS #0 screw from the right Joy-Con rail.

    • Remove the single 3.8mm JIS #0 screw from the left Joy-Con rail.

  6. Pull the rear panel up and off of the device. Pull the rear panel up and off of the device. Pull the rear panel up and off of the device.
    • Pull the rear panel up and off of the device.

  7. Remove the single 3.1mm JIS #000 screw from micro SD card board.
    • Remove the single 3.1mm JIS #000 screw from micro SD card board.

  8. Skip the upgrade.

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  9. Lift the micro SD card board up and pull towards you to disconnect it from the motherboard. Lift the micro SD card board up and pull towards you to disconnect it from the motherboard.
    • Lift the micro SD card board up and pull towards you to disconnect it from the motherboard.

  10. Remove the six 3.1mm JIS #000 screws from the shield plate.
    • Remove the six 3.1mm JIS #000 screws from the shield plate.

  11. Remove the shield plate from the device. A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. Use our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro. A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. Use our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro.
    • Remove the shield plate from the device.

    • A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. Use our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro.

  12. Insert the pointed end of a spudger underneath the white connector and pry upwards to disconnect the battery from the motherboard. Insert the pointed end of a spudger underneath the white connector and pry upwards to disconnect the battery from the motherboard.
    • Insert the pointed end of a spudger underneath the white connector and pry upwards to disconnect the battery from the motherboard.

  13. Remove the three 3.1mm JIS #000 screws from the heatsink.
    • Remove the three 3.1mm JIS #000 screws from the heatsink.

  14. Pull the heatsink up 45 degrees and rotate it to the right to remove. Pull the heatsink up 45 degrees and rotate it to the right to remove. Pull the heatsink up 45 degrees and rotate it to the right to remove.
    • Pull the heatsink up 45 degrees and rotate it to the right to remove.

  15. Remove the two 3.1mm JIS #000 screws from the headphone jack reinforcement plate.
    • Remove the two 3.1mm JIS #000 screws from the headphone jack reinforcement plate.

  16. Remove the reinforcement plate from the headphone jack. Remove the reinforcement plate from the headphone jack.
    • Remove the reinforcement plate from the headphone jack.

  17. Use a spudger to flip up the small black locking flap on the screen ZIF connector. Use a spudger to flip up the small black locking flap on the screen ZIF connector.
    • Use a spudger to flip up the small black locking flap on the screen ZIF connector.

  18. Use the pointed end of a spudger to slide the ribbon cable out of the ZIF connector. Use the pointed end of a spudger to slide the ribbon cable out of the ZIF connector.
    • Use the pointed end of a spudger to slide the ribbon cable out of the ZIF connector.

  19. Remove the single 3.1mm JIS #000 screw from the headphone jack and game card board.
    • Remove the single 3.1mm JIS #000 screw from the headphone jack and game card board.

  20. Use the flat end of a spudger to pry up the headphone jack press-fit connector from the motherboard. Use the flat end of a spudger to pry up the headphone jack press-fit connector from the motherboard.
    • Use the flat end of a spudger to pry up the headphone jack press-fit connector from the motherboard.

  21. Remove the headphone jack and game card board. Remove the headphone jack and game card board.
    • Remove the headphone jack and game card board.

결론

To reassemble your device, follow these instructions in reverse order.

다른 10명이 해당 안내서를 완성하였습니다.

Blake Klein

회원 가입일: 2017년 01월 29일

45,544 평판

안내서 48개 작성하였습니다

The SD card slot removal wasn’t in the guide, but otherwise spot on. Thanks!

Justin Lowmaster - 답글

Good catch! It’s updated now :)

Blake Klein -

It worked, thanks

Angie Rayos - 답글

After changing the board out, I don’t have touch on the screen, put the original PCB back in the console and i have touch again, so its not that I did any damage to the flexes or ZIF connector. Any one have any ideas?

Griffin Kennedy - 답글

Hey man, did you ever figure this out? I have the exact same issue. My touchscreen is no longer working.

Uncle Jessy -

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