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소개

Follow this guide to replace the heat shield plate in a Nintendo Switch gaming console.

  1. Remove the four 6.3mm Tri-point Y00 screws from the rear panel.
    • Remove the four 6.3mm Tri-point Y00 screws from the rear panel.

  2. Remove the single 6.1mm JIS #000 screw from underneath the kickstand.
    • Remove the single 6.1mm JIS #000 screw from underneath the kickstand.

  3. Remove the two 2.7mm JIS #000 screws from the bottom of the device.
    • Remove the two 2.7mm JIS #000 screws from the bottom of the device.

  4. Remove the single 2.7mm JIS #000 screw from the top of the device.
    • Remove the single 2.7mm JIS #000 screw from the top of the device.

  5. Remove the single 3.8mm JIS #0 screw from the right Joy-Con rail. Remove the single 3.8mm JIS #0 screw from the left Joy-Con rail.
    • Remove the single 3.8mm JIS #0 screw from the right Joy-Con rail.

    • Remove the single 3.8mm JIS #0 screw from the left Joy-Con rail.

  6. Pull the rear panel up and off of the device. Pull the rear panel up and off of the device. Pull the rear panel up and off of the device.
    • Pull the rear panel up and off of the device.

  7. Remove the single 3.1mm JIS #000 screw from micro SD card board.
    • Remove the single 3.1mm JIS #000 screw from micro SD card board.

  8. Lift the micro SD card board up and pull towards you to disconnect it from the motherboard. Lift the micro SD card board up and pull towards you to disconnect it from the motherboard.
    • Lift the micro SD card board up and pull towards you to disconnect it from the motherboard.

  9. Remove the six 3.1mm JIS #000 screws from the shield plate.
    • Remove the six 3.1mm JIS #000 screws from the shield plate.

  10. Remove the shield plate from the device. A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. If needed, during reassembly, use our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro. A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. If needed, during reassembly, use our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro.
    • Remove the shield plate from the device.

    • A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. If needed, during reassembly, use our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro.

결론

To reassemble your device, follow these instructions in reverse order.

Blake Klein

회원 가입일: 2017년 01월 29일

44,055 평판

안내서 48개 작성하였습니다

Hey - I think you’re missing a step, how do you remove the SD card reader?

Terra Field - 답글

Great catch! The guide has been updated, thanks!

Blake Klein -

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