#11단계의 변경 사항
편집자 Taylor Dixon-
편집 승인됨 완료자 Taylor Dixon
- 이전
- 이후
- 변경 사항 없음
단계 라인
| [* black] We're starting to see a trend here. Getting the next layer out of this case requires—you guessed it—heaps of heat, a plethora of prying, and a pair of pliers. | |
| [* black] We immediately notice that this generation's logic board is more ... goopier ... than the [guide|75578|board|stepid=152781|new_window=true] that emerged from the wreckage of the first AirPod fiasco—probably to help with water resistance. | |
| [* black] Finally, a beacon in the darkness—there's [guide|75578|still|stepid=152780|new_window=true] a modular charging port! | |
| [* black] ... although if you tunnel this far into the case, there's a good chance you now have more broken parts than just the charging port. | |
| [* black] Beneath that shiny liquid-resistant coating, we make out some chips: | |
| - | [* red] Broadcom 58356A2KUBG |
| + | [* red] Broadcom 58356A2KUBG (possibly from the BCM5830X family of [https://www.broadcom.com/products/embedded-and-networking-processors/secure/bcm5830x/|secure SOCs|new_window=true]) |
| [* orange] L476MGY6 A5 | |
| - | [* yellow] |
| + | [* yellow] TI 87A6FP |