#10단계의 변경 사항
편집자 Luke Soules-
- 이전
- 이후
- 변경 사항 없음
단계 라인
| [* black] This machine features not only the large primary heat sink, but also two smaller heat sinks. | |
| [* black] Holy thermal paste! Time will tell if the gobs of thermal paste applied to the CPU and GPU will cause overheating issues down the road. | |
| [* black] In the [guide|2212|Mid 2010 15" Unibody], there was only the one large heat sink to cool the CPU and GPU. Also for that revision, the graphics switching chip in the second image was present, but didn't receive a heat sink. | |
| [* black] The chip under the heat sink in the third image is a new chip that is perhaps used to support the new Thunderbolt interface. | |
| - | [* black] For this model, both the graphics switching chip and the Thunderbolt chip received heat sink plates to conduct heat into the aluminum upper case. |